Silicon wafers containing conductive feedthroughs

Details Silicon wafers containing conductive feedthroughs Silicon wafers containing conductive feedthroughs

1990-11-26

1992-11-24

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437195, 437915, H01L 2128

Patent

active

051660970

ABSTRACT:
Methods of forming electrically and/or thermally conductive feedthroughs in silicon wafers by etching a patterned silicon wafer, and formation of multichip modules utilizing silicon wafers having feedthroughs, are disclosed.

REFERENCES:
patent: 3986196 (1976-10-01), Decker et al.
patent: 4275410 (1981-06-01), Grinberg et al.
patent: 4374457 (1983-02-01), Wiech, Jr.
patent: 4617730 (1986-10-01), Geldermans et al.
patent: 4695872 (1987-09-01), Chatterjee
patent: 4737470 (1988-04-01), Bean
patent: 4765864 (1988-08-01), Holland et al.
patent: 4849374 (1989-07-01), Chen et al.
patent: 4954458 (1990-09-01), Reid
patent: 5039628 (1991-08-01), Carey

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