Silicon wafer polishing

Details Silicon wafer polishing Silicon wafer polishing

1975-12-05

1977-11-15

Arnold, Donald J.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51307, 51308, 106 3, B24B 100

Patent

active

040579395

ABSTRACT:
The polishing of monocrystalline silicon wafers with an aqueous composition of fine sized abrasive particles, a soluble alkali metal base such a sodium carbonate and an oxidizing agent such as sodium or potassium salt of dichloroisocyanuric acid (e.g., salts of halo-trizenetrione).

REFERENCES:
patent: 3328141 (1967-06-01), Lachapelle
patent: 3552071 (1971-01-01), Albanese
patent: 3715842 (1973-02-01), Tredinnick et al.
patent: 3807979 (1974-04-01), Cromwell
patent: 3874129 (1975-01-01), Deckert
patent: 3922393 (1975-11-01), Serrs
IBM Technical Disclosure Bulletin, vol. 15, No. 6, Nov. 1972, pp. 1760-1761, Planetary "Free" Wafer Polisher by F. E. Goetz et al.
IBM Technical Report Tr. 22.322, Dec. 21, 1966, Polishing of Silicon by E. Mendel, pp. 1-28.

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