Silicon wafer based macroscopic mirror for wide angle...

Optical: systems and elements – Mirror – With support

Reexamination Certificate

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C359S224200

Reexamination Certificate

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06953254

ABSTRACT:
A macroscopic mirror for wide angle scanning applications comprises: a silicon substrate section of a predetermined shape and macroscopic size cut from a silicon wafer comprising a flat, polished surface side and an etched, rough surface side; and a plurality of layers, including a layer of reflective medium, disposed on the flat, polished surface of the substrate section in such a manner to minimize flexural distortion of the flat surface. The macroscopic mirror is made by a method comprising the steps of: preparing the silicon wafer by polishing one side to a predetermined flatness and etching the other side to a predetermined roughness; cutting the substrate section from the prepared silicon wafer to a predetermined shape and macroscopic size; and applying the plurality of layers on the flat, polished surface. The macroscopic mirror is included in a mirror system wherein the rough surface side is bonded to supporting arms of a drive mechanism which scans the mirror at a predetermined scanning rate in at least one plane of rotation.

REFERENCES:
patent: 6201629 (2001-03-01), McClelland et al.
patent: 6379510 (2002-04-01), Kane et al.
patent: 6387466 (2002-05-01), Fusegawa et al.
patent: 6426013 (2002-07-01), Neukermans et al.
patent: 2003/0137759 (2003-07-01), Pesik
patent: 1225 469 (2002-07-01), None
patent: WO 02/059942 (2002-08-01), None
Article “Electrostatic Micromirros for Subaperturing in an Adaptive Optics System”, Mark N. Horenstein et al., Journal of Electronics 54 (2002) pp. 321-332.
International Search Report from PCT/US2004/014359.

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