Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-06-07
1995-08-15
Aftergut, Jeff H.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156281, 437974, 437921, 437225, 437 21, 148DIG12, 148DIG135, 148DIG150, H01L 21304
Patent
active
054415918
ABSTRACT:
A method of bonding silicon to sapphire may be performed at room temperature and with no greater pressure than that due to one wafer resting on another. The method comprises the steps of polishing one side of a flat sapphire wafer to a mirror-like surface; polishing one side of a flat silicon wafer to a mirror-like surface; cleaning the wafers and then stacking the wafers so that their corresponding mirror-like surfaces contact. The room temperature bonding that occurs is relatively strong, and the bonded wafers can be handled without danger of their becoming unbonded. If desired, the bonded wafers may be subjected to further processing to further strengthen their bond.
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Imthurn George P.
Walker Howard
Aftergut Jeff H.
Fendelman Harvey
Keough Thomas Glenn
Lipovsky Peter A.
The United States of America as represented by the Secretary of
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