Silicon substrate with identification data

Details Silicon substrate with identification data Silicon substrate with identification data

1999-02-19

2001-04-17

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

With measuring or testing

C438S016000, C438S017000, C438S018000, C368S010000, C368S327000, C714S025000, C714S046000

Reexamination Certificate

active

06218199

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a silicon wafer having identification data composed of a two-dimensional code on a silicon wafer, which becomes a semiconductor substrate, and a silicon substrate of a semiconductor chip, and a production method thereof.
2. Description of the Prior Art
Recently, in semiconductor production processes, it has been required to individually manage each of silicon wafers or semiconductor chips whose circuits are formed on these silicon wafers in each process. Since a silicon wafer is hard and clear, it is not possible to print identification data such as a kind of material and a production number on this wafer. Hence, conventionally, the wafer is directly burnt by a laser for expressing an article number and the like in alphabetic characters and figures.
In addition, since a semiconductor chip obtained by dicing semiconductor circuits, which are formed on the silicon wafer, in several cm square is small, it is not possible to individually manage each semiconductor chip because of no space for describing the identification data. In this manner, it is not possible to record plenty of information such as a manufacturer's name, a production date, a kind of material, and a production number. It is because the data volume described is small if the data is expressed in the alphabetic characters and FIGS. on a silicon substrate such as a silicon wafer and a semiconductor chip.
BRIEF SUMMARY OF THE INVENTION
OBJECT OF THE INVENTION
The present invention is performed to solve this problem. The present invention provides a silicon substrate with identification data, which can individually manage a silicon wafer and a small semiconductor chip by forming a two-dimensional code, which can record plenty of data, on a hard and clear silicon surface, and a production method thereof.
SUMMARY OF THE INVENTION
A silicon substrate with identification data that is a first form of the present invention is characterized in forming a two-dimensional code composed of a matrix having a bright and dark pattern by defining a smooth surface as a dark-pattern unit cell, defining a scattering surface as a bright-pattern unit cell, and combining these dark-pattern unit cells with bright-pattern unit cells.
In addition, a silicon substrate with identification data that is a second form of the present invention is characterized in that a bright-pattern cell in a two-dimensional code formed by a matrix having a bright and dark pattern is formed by unit cells composed of dots, which are arranged in n rows and n columns, or n rows and m columns (here, n and m are integers) and each is round in a top view, and that each of the round dots is formed by a hemispherical concave portion.
Furthermore, a production method of a silicon substrate with identification data that is a third form of the present invention is characterized in: forming dots, each of which is round in a top view and is composed of a hemispherical concave portion formed by applying a laser beam on a surface of a silicon substrate; forming a bright-pattern unit cell by arranging these dots in n rows and n columns, or n rows and m columns (here, n and m are integers) vertically and horizontally; defining a smooth surface, where a laser beam is not applied, as a dark-pattern unit cell; and forming a two-dimensional code composed of a matrix having a bright and dark pattern, which is formed by combining these bright unit cells and these dark unit cells.


REFERENCES:
patent: 5862101 (1999-01-01), Haas et al.
patent: 5962862 (1999-09-01), Evers et al.
patent: 6049895 (2000-04-01), Sugimoto

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