Silicon single crystal and method for producing the same

Single-crystal – oriented-crystal – and epitaxy growth processes; – Processes of growth from liquid or supercritical state – Having pulling during growth

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117 32, 117917, C30B 1522

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active

061561193

ABSTRACT:
In a method for producing a silicon single crystal of high quality, the silicon single crystal is grown based on a magnetic field applied Czochralski method. The single crystal is grown at a high growth rate satisfying the equation Vave.gtoreq.120/r, where Vave denotes an average crystal growth rate, and r denotes a radius of the single crystal, and a rotation number R of the single crystal in growing satisfies the equation R.ltoreq.1250/r. Oxygen concentration in-plane distribution is 10% or less, and a deformation ratio of a constant diameter portion in the silicon single crystal in a direction perpendicular to a crystal growth axis direction is 5% or less. The silicon single crystal has a high uniformity of oxygen concentration in-plane distribution without deformation of crystal, even if the crystal is grown at a growth rate exceeding the upper limits found in conventional techniques.

REFERENCES:
patent: 4330362 (1982-05-01), Zulehner
patent: 5851283 (1998-12-01), Hoshi et al.
Nikkei Microdevices, Jul. 1986, by Nobuyuki Izawa, et al., pp. 87-108.
Semiconductor Silicon Crystal Technology, 1989, by Fumio Shimura, pp. 171-183.
8 Crystals, Growth, Properties, and Applications, by W. Zulehner and D. Huber, 1982, pp. 3-57.

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