Silicon seed crystal and method for manufacturing silicon...

Single-crystal – oriented-crystal – and epitaxy growth processes; – Processes of growth from liquid or supercritical state – Having pulling during growth

Reexamination Certificate

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C117S019000, C117S020000

Reexamination Certificate

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07083677

ABSTRACT:
Using a seed crystal comprising a silicon single crystal not including a vacancy excess region, a neck comprising a silicon single crystal not including a vacancy excess region is grown with a diameter contracted smaller than, or equal to that of the contact surface of the silicon seed crystal in contact with a raw material silicon melt, and necking is performed so that the length L of the neck satisfies L≧d·(cot ψ), where d denotes the length of the diameter or the diagonal of the contact surface of the silicon seed crystal in contact with the raw material silicon melt, and ψ denotes the angle formed between the propagation direction of dislocations and the growth direction of the neck, and then the silicon single crystal is grown with the diameter expanded.

REFERENCES:
patent: 5911822 (1999-06-01), Abe et al.
patent: 6869477 (2005-03-01), Haga et al.
patent: 6893499 (2005-05-01), Fusegawa et al.
patent: 4-139092 (1992-05-01), None
patent: 8-319192 (1996-03-01), None
patent: 10-203898 (1998-08-01), None
patent: 2001-199789 (2001-07-01), None

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