Silicon pressure sensor with decreased pressure equalization...

Measuring and testing – Fluid pressure gauge – Diaphragm

Reexamination Certificate

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Reexamination Certificate

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10547967

ABSTRACT:
This invention relates to absolute pressure sensors with two bonded wafers containing a pressure sensing structure and forming a reference pressure chamber and a buffer chamber. Since the buffer chamber collects molecules, which permeate through a bonding interface between the two wafers, a raise in pressure of the reference chamber can be avoided. The sensor is therefore more resistant to pressure equalisation between the pressure chamber and the pressure of the surroundings, i.e. the sensed pressure and repetitive recalibration of the sensor can be avoided.

REFERENCES:
patent: 6346742 (2002-02-01), Bryzek et al.
patent: 6363791 (2002-04-01), Kurosaka et al.
patent: 2002/0073533 (2002-06-01), Park
patent: WO02/29365 (2002-04-01), None
“Selection of glass, anodic bonding conditions and material compatibility for silicon-glass capacitive sensors”; written by T. Rogers et al.; Sensors and Actuators A, 46-47 (1995), pp. 113-120.

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