Silicon package with integral heater

Details Silicon package with integral heater Silicon package with integral heater

2007-03-27

2007-03-27

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S659000, C310S346000, C310S349000

Reexamination Certificate

active

11156353

ABSTRACT:
A hermetic package for electronic components which is made of metallic silicon is disclosed. The package includes a plurality of silicon elements which are bonded together. A metallic layer of platinum or gold is bonded to an internal surface of the hermetically sealed enclosure. While either metallic layer may serve as a heating element by subjecting the electronic circuit connected thereto with a large current, the platinum layer can also be used as a thermal sensor by passing a lower current there through. An internal heater is included to stabilize the performance of the electronic components.

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patent: 6833654 (2004-12-01), Rubach
patent: 2004/0266048 (2004-12-01), Platt et al.

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