Silicon package with embedded oscillator

Details Silicon package with embedded oscillator Silicon package with embedded oscillator

2011-08-02

2011-08-02

Thomas, Tom (Department: 2893)

Electrical generator or motor structure

Non-dynamoelectric

Piezoelectric elements and devices

C310S311000, C310S324000, C310S341000, C310S343000, C257S678000, C257S701000, C257S704000, C257S723000, C257S724000, C257S729000, C257SE23061, C257SE23180, C257SE23181

Reexamination Certificate

active

07990025

ABSTRACT:
A hermetic package for electronic components which is made of metallic silicon is disclosed. The package includes a plurality of silicon elements which are bonded together. In the first embodiment, a cavity is hollowed out in the cover to house the Application Specific Integrated Circuit oscillator and the resonator. In a second embodiment, the cavity is formed in the base member with a plurality of pedestal shelves to hold the resonator above and out of contact with the electrical circuitry for the oscillator and thermal controls.

REFERENCES:
patent: 3969640 (1976-07-01), Staudte
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patent: 5548178 (1996-08-01), Eda et al.
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patent: 6060692 (2000-05-01), Bartley et al.
patent: 6507097 (2003-01-01), Goetz et al.
patent: 6806557 (2004-10-01), Ding
patent: 2004/0017004 (2004-01-01), Kasai et al.
patent: 2004/0217673 (2004-11-01), Unno et al.
patent: 2005/0056917 (2005-03-01), Kwon
Richard C. Jaeger, Introduction to Microelectronic Fabrication, 2002, Prentice Hall, Second Edition, pp. 1 and 2.

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