Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – On insulating substrate or layer
Patent
1995-09-01
1999-11-16
Eisenschenk, Chris
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
On insulating substrate or layer
438368, 438370, 438371, 438473, 438510, 438517, 438545, 438526, 438542, 438914, 438967, 257347, 257607, H01L 2122, H01L 21225
Patent
active
059857285
ABSTRACT:
A silicon on insulator (SOI) process is disclosed which includes the steps of forming an etch stop layer in a starting wafer, forming an insulating layer on the etch stop layer, bonding this wafer to a handle wafer, thinning the start wafer down to the etch stop and then recovering a device layer from the etch stop layer by outgassing dopants from the etch stop layer.
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Eisenschenk Chris
Elantec Semiconductor Inc.
Zeman Mary K
LandOfFree
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