Silicon on insulator process with recovery of a device layer fro

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – On insulating substrate or layer

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438368, 438370, 438371, 438473, 438510, 438517, 438545, 438526, 438542, 438914, 438967, 257347, 257607, H01L 2122, H01L 21225

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active

059857285

ABSTRACT:
A silicon on insulator (SOI) process is disclosed which includes the steps of forming an etch stop layer in a starting wafer, forming an insulating layer on the etch stop layer, bonding this wafer to a handle wafer, thinning the start wafer down to the etch stop and then recovering a device layer from the etch stop layer by outgassing dopants from the etch stop layer.

REFERENCES:
patent: 4601779 (1986-07-01), Abernathy et al.
patent: 4638552 (1987-01-01), Shimbo et al.
patent: 4771016 (1988-09-01), Bajor et al.
patent: 4851078 (1989-07-01), Short et al.
patent: 4883215 (1989-11-01), Goesele et al.
patent: 4888304 (1989-12-01), Nakagawa et al.
patent: 4939101 (1990-07-01), Black et al.
patent: 4962879 (1990-10-01), Goesele et al.
patent: 4987093 (1991-01-01), Teng
patent: 5013681 (1991-05-01), Godbey et al.
patent: 5028558 (1991-07-01), Haisma et al.
patent: 5034343 (1991-07-01), Rouse et al.
patent: 5036021 (1991-07-01), Goto
patent: 5147808 (1992-09-01), Pronko
patent: 5213986 (1993-05-01), Pinker et al.
patent: 5234535 (1993-08-01), Beyer et al.
patent: 5266135 (1993-11-01), Short et al.
patent: 5334273 (1994-08-01), Short et al.
patent: 5334524 (1994-08-01), Sharma et al.
patent: 5362667 (1994-11-01), Linn et al.
patent: 5366924 (1994-11-01), Easter et al.
patent: 5387555 (1995-02-01), Linn et al.
patent: 5395788 (1995-03-01), Abe et al.
patent: 5407856 (1995-04-01), Quenzer et al.
patent: 5527724 (1996-06-01), Brady

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