Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2006-03-28
2006-03-28
Abraham, Fetsum (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
27
Reexamination Certificate
active
07019390
ABSTRACT:
An aspect of the present invention provides a power module for automotive switching applications including a plurality of semiconductor chips and a unitary silicon nitride substrate. The plurality of semiconductor chips are attached to the silicon nitride substrate and the substrate is configured to have a thermal coefficient of expansion substantially the same as the plurality of semiconductor chips.
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Clark Terence J.
Colino Ronald P.
Fain James
Karpchuck Sylvester
Sheng William W.
Abraham Fetsum
Visteon Global Technologies Inc.
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