Silicon nitride ceramic circuit substrate and semiconductor devi

Stock material or miscellaneous articles – Composite – Of quartz or glass

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501 971, 501 974, 428432, 428336, 428216, 428469, 428472, 428697, 428698, 428699, 228122, C04B 3558

Patent

active

061105961

ABSTRACT:
Disclosed are a circuit substrate which comprises a silicon nitride ceramic plate 1 having a thermal conductivity at room temperature of 80 W/mK or more and a metal plate 2 joined to the silicon nitride ceramic plate 1 through a glass layer 3, and a semiconductor device in which the circuit substrate is mounted.

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Tsuge and Nishida, "High Strength Hot-Pressed Si.sub.3 N.sub.4 with Concurrent Y.sub.2 O.sub.3 and Al.sub.2 O.sub.3 Additions", Ceramic Bulletin, vol. 57, No. 4, 1978, pp. 424-431.
Tanaka et al, "Surface Characteristics of Metal Bondable Silicon Nitride Ceramics", Proc. of International Symposium on Ceramic Components for Engine, Japan, 1993, pp. 249-256.

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