Electrical audio signal processing systems and devices – Electro-acoustic audio transducer – Microphone capsule only
Reexamination Certificate
2007-10-05
2011-10-25
Chambliss, Alonzo (Department: 2892)
Electrical audio signal processing systems and devices
Electro-acoustic audio transducer
Microphone capsule only
C381S191000, C381S369000, C367S181000, C438S053000
Reexamination Certificate
active
08045733
ABSTRACT:
A backplateless silicon microphone and a wire protection method for improved impact resistance are disclosed. A circular diaphragm is surrounded by a circular spring having a plurality of slots and perforations to facilitate air damping reduction, release of in-plane stress, and improve out-plane flexibility. Anchored at a substrate, the circular spring holds the silicon microphone suspended over a backside hole in the substrate but allows the diaphragm to vibrate perpendicular to the substrate. A microphone variable capacitor is formed between the perforated spring and substrate. Slot size is minimized to prevent particles from entering an underlying air gap. A plurality of “n” bonding pads near the outer edge of the circular spring are connected by “n/2” bonding wires that serve as a stopper to restrict an upward motion of the diaphragm. The bonding wires may cross each other to enable lower loop height for more effective resistance to impact.
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Co-pending U.S. Appl. No. 11/500,114, filed Aug. 7, 2006 , “Silicon Microphone With Impact Proof Structure”, Assigned to the Same Assignee As the Present Invention.
Choong Chong Ser
Zhe Wang
Ackerman Stephen B.
Chambliss Alonzo
Saile Ackerman LLC
Shandong Gettop Acoustic Co. Ltd.
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