Electrical audio signal processing systems and devices – Electro-acoustic audio transducer – Microphone capsule only
Reexamination Certificate
2011-05-24
2011-05-24
Kuntz, Curtis (Department: 2614)
Electrical audio signal processing systems and devices
Electro-acoustic audio transducer
Microphone capsule only
C381S175000, C381S189000, C381S190000, C381S191000
Reexamination Certificate
active
07949142
ABSTRACT:
A silicon condenser microphone has an additional back chamber and a sound hole in a PCB. The microphone includes a case for blocking an external sound; a substrate including a chamber case, a MEMS chip having an additional back chamber formed by the chamber case, an ASIC chip for operating the MEMS chip, a conductive pattern for a bonding to the case, and a sound hole for passing the external sound. A fixing means fixes the case to the substrate and an adhesive is applied to an entirety of a bonding surface of the case and the substrate fixed by the fixing means. When the sound hole is formed through the PCB instead of the case, the mounting space for a microphone is reduced. The chamber case forms the additional back chamber under the MEMS chip and is employed to increase back chamber space to improve sensitivity and reduce noise.
REFERENCES:
patent: 6781231 (2004-08-01), Minervini
patent: 7436054 (2008-10-01), Zhe
patent: 2003/0021432 (2003-01-01), Scheeper et al.
patent: 2004/0046245 (2004-03-01), Minervini
patent: 2004/0202345 (2004-10-01), Stenberg et al.
patent: 2005/0018864 (2005-01-01), Minervini
patent: 2005/0025328 (2005-02-01), Song
patent: 103 03 263 (2004-08-01), None
patent: 0 613 196 (1994-08-01), None
patent: 1 047 295 (2000-10-01), None
patent: 2-63590 (1990-05-01), None
patent: 2000-048952 (2000-02-01), None
patent: 2000-307022 (2000-11-01), None
patent: 2001-083004 (2001-03-01), None
patent: 2003-508997 (2003-03-01), None
patent: 2004-200766 (2004-07-01), None
patent: 2007-178221 (2007-07-01), None
patent: 2008-510427 (2008-04-01), None
patent: 01/19133 (2001-03-01), None
patent: 03/090281 (2003-10-01), None
patent: WO 2005 086535 (2005-09-01), None
patent: 2006/023016 (2006-03-01), None
J.W. Weigold, et al; “A MEMS Condenser Microphone for Consumer Applications” Micro Electro Mechanical Systems, 2006. MEMS 2006 Istanbul. 19thIEEE International Conference on Istanbul, Turkey Jan. 22-26, 2006, Piscataway, NJ, USA, IEEE Jan. 22, 2006 pp. 86-89, XP010914531 ISBN: 978-0-7803-9475-9 abstract, paragraphs [0001], [0002].
Japanese Office Action, Appln. No. 2008-514568, mailed Oct. 5, 2010 with concise statement of relevance for ref. JP2-63590.
European Search Report: EP 06 78 3527.
European Search Report: EP 10 00 0467.
BSE Co., Ltd.
Eason Matthew
Kuntz Curtis
Ladas & Parry LLP
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