Silicon compatible integrated light communicator

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Using epitaxial lateral overgrowth

Reexamination Certificate

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C438S479000, C438S481000, C438S492000, C257SE21086

Reexamination Certificate

active

07875522

ABSTRACT:
Various methods and devices are implemented using efficient silicon compatible integrated light communicators. According to one embodiment of the present invention, a semiconductor device is implemented for communicating light, such as by detecting, modulating or emitting light. The device has a silicon-seeding location, an insulator layer and a second layer on the insulator layer. The second layer includes a silicon-on-insulator region and an active region surrounded by the silicon-on-insulator region and connected to the silicon-seeding location. The active region includes a single-crystalline germanium-based material that extends from the silicon-seeding location through a passageway with a cross-sectional area that is sufficiently small to mitigate crystalline growth defects. The single-crystalline germanium-based material is physically coupled to the insulating layer such that the insulating layer introduces a high tensile strain to the germanium-based material, and a more specific aspect is directed to an SOI implementation.

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patent: 2006/0252235 (2006-11-01), Aberle et al.
patent: 2006/0267017 (2006-11-01), Noguchi et al.
patent: WO2005/094254 (2005-10-01), None
S. Balakumar et al. “Fabrication Aspects of Germanium on Insulator from Sputtered Ge on Si-Substrates.” Electrochemical and Solid State Letters, vol. 9, No. 5, G158-G160 (2006).
O. Dosunmu et al. “Resonant Cavity Enhanced Ge Photodetectors for 1550 nm Operation on Reflecting Si Substrates.” IEEE journal of Selected Topics in Quantum Electronics, vol. 10, No. 4, p. 694-701 (Jul./Aug. 2004).

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