Silicon chip having inclined contact pads and electronic...

Details Silicon chip having inclined contact pads and electronic... Silicon chip having inclined contact pads and electronic...

2007-11-09

2010-11-02

Le, Thao X (Department: 2892)

Fishing, trapping, and vermin destroying

Vermin destroying

Fumigators

C438S126000, C438S106000, C257S679000, C257S732000, C257S622000, C257S703000, C361S761000, C361S764000, C361S737000

Reexamination Certificate

active

07823322

ABSTRACT:
A semiconductor chip has an active face in which an integrated circuit region is implanted. The chip includes an inclined lateral contact pad extending beneath the plane of the active face and electrically linked to the integrated circuit region. An electronic module includes a substrate having a cavity in which the chip is arranged. The module can be applied to the production of thin contactless micro-modules for smart cards and contactless electronic badges and tags.

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