Silicon carrier having increased flexibility

Details Silicon carrier having increased flexibility Silicon carrier having increased flexibility

2005-12-30

2008-03-18

Louie, Wai-Sing (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

With groove to define plural diodes

C257S618000, C257S622000

Reexamination Certificate

active

07345353

ABSTRACT:
An apparatus and method providing flexibility to a silicon chip carrier which, in at least one embodiment, comprises multiple chips and a silicon chip carrier having thinned regions between some adjacent chips, thus, allowing for increased flexibility and reduced package warpage.

REFERENCES:
patent: 6274929 (2001-08-01), Leong et al.
patent: 6294840 (2001-09-01), McCormick
patent: 6437990 (2002-08-01), Degani et al.
patent: 6849843 (2005-02-01), Ansorge et al.
patent: 6946743 (2005-09-01), Silverbrook
patent: 2002/0050403 (2002-05-01), Yasukawa
patent: 2002/0079575 (2002-06-01), Hozoji
patent: 2005/0130383 (2005-06-01), Divakaruni et al.
patent: 2005/0189644 (2005-09-01), Ho
patent: 2005/0285246 (2005-12-01), Haba et al.
patent: 2006/0079072 (2006-04-01), David et al.
patent: 1 351 299 (2003-10-01), None
patent: 2002029891 (2002-01-01), None
Knickerbocker, J. U. et al., Development of next-generation technology based on silicon carriers with fine-pitch chip interconnection, IBM J. Res. & Dev., 725-53, Jun. 2005.
Search Report on PCT Application No. PCT/EP2006/069774.
Knickerbocker et al, Development of Next-Generation System-On-Package (SOP) technology based on silicon carriers with fine-pitch chip interconnection, IBM J. Res. & Dev. vol. 49, No. 4/5 Jul./Sep. 2005.

Affiliated with

Also associated with

Rating

Silicon carrier having increased flexibility does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Silicon carrier having increased flexibility, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Silicon carrier having increased flexibility will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3961501