Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than... – Diamond or silicon carbide
Reexamination Certificate
2008-10-02
2010-10-05
Soward, Ida M (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Specified wide band gap semiconductor material other than...
Diamond or silicon carbide
C257SE21603, C257SE21605, C257SE29297, C257SE29298
Reexamination Certificate
active
07808003
ABSTRACT:
A silicon carbide semiconductor device is disclosed. The silicon carbide semiconductor device includes a substrate; a drift layer having a first conductivity type and located on a first surface of the substrate; and a vertical type semiconductor element. The vertical type semiconductor element includes: an impurity layer having a second conductivity type, and located in a surface portion of the drift layer; and a first conductivity type region located in the drift layer, spaced away from the impurity layer, located closer to the substrate than the impurity layer, and having an impurity concentration higher than the drift layer.
REFERENCES:
patent: 5719409 (1998-02-01), Singh et al.
patent: 5864159 (1999-01-01), Takahashi
patent: 5895939 (1999-04-01), Ueno
patent: 5976936 (1999-11-01), Miyajima et al.
patent: 6020600 (2000-02-01), Miyajima et al.
patent: 6057558 (2000-05-01), Yamamoto et al.
patent: 6573534 (2003-06-01), Kumar et al.
patent: 6576929 (2003-06-01), Kumar et al.
patent: 6600192 (2003-07-01), Sugawara et al.
patent: 6936850 (2005-08-01), Friedrichs et al.
patent: 6949401 (2005-09-01), Kaminski et al.
patent: 7282739 (2007-10-01), Kaneko
patent: 7414268 (2008-08-01), Ryu et al.
patent: 2002/0079535 (2002-06-01), Tihanyi et al.
patent: 2006/0255423 (2006-11-01), Ryu et al.
patent: 2007/0170436 (2007-07-01), Sugawara
patent: 2007/0252172 (2007-11-01), Hayashi et al.
patent: 2008/0087951 (2008-04-01), Takaya et al.
patent: 2008/0191304 (2008-08-01), Zhang et al.
patent: 2009/0134402 (2009-05-01), Yatsuo et al.
patent: A-01-192175 (1989-08-01), None
patent: A-5-55594 (1993-03-01), None
patent: A-05-75099 (1993-03-01), None
patent: A-07-176731 (1995-07-01), None
patent: A-2000-252478 (2000-09-01), None
patent: A-2001-094098 (2001-04-01), None
patent: A-2003-229570 (2003-08-01), None
patent: A-2004-228287 (2004-08-01), None
patent: A-2006-93193 (2006-04-01), None
patent: A-2006-196652 (2006-07-01), None
patent: A-2007-220878 (2007-08-01), None
Office Action mailed Dec. 15, 2009 from the Japan Patent Office for corresponding patent application No. 2007-262031 (English translation enclosed).
Notification of Reason for Refusal issued from the Japanese Patent Office on Jun. 1, 2010 in the corresponding Japanese patent application No. 2007-262031 (a copy and English translation thereof).
Endo Takeshi
Okuno Eiichi
DENSO CORPORATION
Posz Law Group , PLC
Soward Ida M
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