Silicon carbide Schottky diode and method of making the same

Details Silicon carbide Schottky diode and method of making the same Silicon carbide Schottky diode and method of making the same

2008-05-06

2008-05-06

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Forming schottky junction

C438S571000, C438S581000, C257SE21047

Reexamination Certificate

active

11453801

ABSTRACT:
A method of forming silicon carbide Schottky diode is disclosed. The processes required two photo-masks only. The processes are as follows: firstly, an n+-silicon carbide substrate having an n− silicon carbide drift layer is provided. Then a silicon layer is formed on the drift layer. An ion implant is carried out to dope the silicon layer. Afterward the doped silicon layer is patterned to define an active region. A thermal oxidation is then followed to form a thick oxide layer by oxidizing the silicon layer and form guard rings by using the doped silicon layer as a diffused source. The thin oxide layer on the drift layer is then removed by dilute HF dip or by BOE (buffer oxide etching) solution dip. Thereafter, a top metal layer is deposited and patterned to define as anode. After a backside layer removal, a metal layer served as cathode is formed.

REFERENCES:
patent: 2006/0006394 (2006-01-01), Kordina

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