Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1985-12-06
1987-09-29
Morgenstern, Norman
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 44, 427 541, 427227, 427228, 427296, 427341, 427377, 427379, B05D 306, B05D 302
Patent
active
046968270
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
This invention relates to a silicon carbide-carbon composite molded product containing a fibrous, granular and/or filmy carbon structure in the matrix consisting mainly of SiC, and to a process for manufacturing the same.
BACKGROUND ART
Manufacture of molded products of silicon carbide is generally based on subjecting pressure and heat to silicon carbide powder mixed with a sintering assistant in a graphite press tool. With zero-pressure sintering method, the thus pressed material is burned in a vacuum or non-oxidizing atmosphere. According to reaction sintering method, the formation of silicon carbide from its materials and the sintering of silicon carbide are carried out successively. There are also known self-sintering method, and silicon-injection sintering method and so on as conventional methods. Each of these methods has, however, the disadvantage that only products having a relatively simple shape, such as planar or columnar, can be obtained. In order to obtain molded products having a more complicated shape, there have been proposed improved methods, such as powder vehicle or pseudoisostatic hot press method, multi-punch hot press method and hot isostatic press method, each of which consists essentially of compacting the molded material filled in a powder vehicle. These methods, however, provide products still limited in shape and dimensions, and require complicated facilities of high performance and a high manufacturing cost.
As one of the methods of molding the material to be sintered, sheet dipping method, which is a method for molding mainly thin plates, is known. This method comprises dipping paper with a coagulant adsorbed on the surface thereof in a slurry in which ceramic powder is peptized, and fixing the powder on the paper surface by ion exchange. Japanese Patent Application No. 46-7604 discloses a method of making paper from a mixed slurry composed of cellulose pulp and a ceramic powder which is used as a filler. These methods, however, have problems of low ceramic powder content, limited range of moldability and low yield owing to cracking or deformation on burning. Moreover, when silicon carbide is used as a material for the molded product, a high burning temperature not lower than 1,700.degree. C. is generally required since silicon carbide is difficult to sinter.
DISCLOSURE OF THE INVENTION
It is an object of this invention to provide a molded product consisting mainly of silicon carbide and having a fine and complicated shape that has not been realized by any conventional method, and to manufacture such a molded product at a lower temperature.
The inventors of this invention have made an extensive research, noting that an organic silicon polymer having a skeleton consisting mainly of carbon-silicon bonds forms .beta.-SiC when it is burned at a temperature of about 800.degree. C. or higher in a non-oxidizing atmosphere, and utilizing that this polymer is soluble in an ordinary organic solvent and can melt by heat. As a result, it was found that the object of this invention can be attained by dipping in a solution or a molten bath of an organic silicon polymer a base material which has been molded into an appropriate shape and which forms a fibrous, granular and/or filmy carbon structure when burned in a non-oxidizing stmosphere since whereby the polymer is easily impregnated into or adheres to the molded material, and by burning the molded material at a temperature of about 700.degree. C. of higher in a non-oxidizing atmosphere.
The silicon carbide-carbon composite molded product of this invention has a fibrous, granular and/or filmy carbon structure in the matrix consisting mainly of SiC and containing 40 to 65% by weight of Si, 25 to 45% by weight of C, 0.1 to 30% by weight of O, and 0.01 to 2% by weight of H.
The process for manufacturing a silicon carbide-carbon composite molded product according to this invention comprises the first step of applying an organic silicon polymer having a skeleton consisting mainly of carbon-silicon bonds by impregnation or
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Hasegawa Yoshio
Kuroo Yoshiyasu
Okamura Kiyohito
Ugaji Masana
Bell Janyce A.
Morgenstern Norman
Sony Corporation
The Foundation: The Research Institute for Special Inorganic Mat
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