Silicon carbide capillaries

Stock material or miscellaneous articles – Hollow or container type article – Polymer or resin containing

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219 56, 228 31, 228 33, B23K 100, B23K 300

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active

047724986

ABSTRACT:
A capillary for use in ball bonding tools designed to bond metal leads to the bonding pads on a microchip and pads or leads on a chip support is formed by chemically vapor depositing a substantially smooth silicon carbide coating having high electrical resistivity onto a substrate which is then removed by etching or combustion.

REFERENCES:
patent: 3472443 (1966-04-01), Holzl et al.
patent: 4171477 (1979-10-01), Funari
patent: 4427445 (1984-01-01), Holzl et al.
patent: 4515860 (1985-05-01), Holzl
patent: 4581295 (1986-04-01), De Liso et al.
Brochure: "Hughes Puts Automatic Hybrid Bonding in a Whole New Light".
"Microelectronic Manufacturing and Testing", Aug. 1984, pp. 53-55.

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