Silicon carbide and related wide-bandgap transistors on...

Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than... – Diamond or silicon carbide

Reexamination Certificate

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C257S194000, C257S103000, C257S078000, C257S256000, C257S195000, C257S369000, C438S105000, C438S931000, 43

Reexamination Certificate

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07009209

ABSTRACT:
A silicon carbide semi-insulating epitaxy layer is used to create power devices and integrated circuits having significant performance advantages over conventional devices. A silicon carbide semi-insulating layer is formed on a substrate, such as a conducting substrate, and one or more semiconducting devices are formed on the silicon carbide semi-insulating layer. The silicon carbide semi-insulating layer, which includes, for example, 4H or 6H silicon carbide, is formed using a compensating material, the compensating material being selected depending on preferred characteristics for the semi-insulating layer. The compensating material includes, for example, boron, vanadium, chromium, or germanium. Use of a silicon carbide semi-insulating layer provides insulating advantages and improved thermal performance for high power and high frequency semiconductor applications.

REFERENCES:
patent: 4794608 (1988-12-01), Fujita et al.
patent: 5138401 (1992-08-01), Yamazaki
patent: 5270554 (1993-12-01), Palmour
patent: 5597744 (1997-01-01), Kamiyama et al.
patent: 5611955 (1997-03-01), Barrett et al.
patent: 5967794 (1999-10-01), Kodama
patent: 6218680 (2001-04-01), Carter et al.
patent: 6303508 (2001-10-01), Alok
patent: 6310385 (2001-10-01), Ajit
patent: 6410396 (2002-06-01), Casady et al.
Trivedi, M., et al., “Comparison of RF Performance of Vertical and Lateral DMOSFET”, IEEE Int'l Symposium on Power Semiconductor Devices and ICs, p. 245-248, May 1999.
Mazzola, M.S., et al., “Close Compensation of 6H and 4H Silicon Carbide By Silicon-to-Carbon Ratio Control”, Materials Science and Engineering, pp. 155-157, 1999.
Mazzola, M.S., et al., “Boron Compensation of 6H Silicon Carbide”, Materials Science Forum, vols. 264-268, pp. 119-122, 1998.
Hiraoka, Y., et al., “Comparison of High-Frequency Performance of Quasi-SOI and Conventional SOI Power MOSFETs”, 2000 International Symposium on Power Semiconductor Devices and IC's, p. 161-164, May 22-25, 2000.
Ludikhuize, A.W., “A Review of RESURF Technology”, 2000 International Symposium on Power Semiconductor Devices and IC's, p. 11-18, May 22-25, 2000.
Tan, Y., et al., “A SOI LDMOS/CMOS/BJT Technology for Fully-Integrated RF Power Amplifiers”, 2000 International Symposium on Power Semiconductor Devices and IC's, p. 137-140, May 22-25, 2000.
Spitz, J., et al., “High-Voltage (2.6 kV) Lateral DMOSFETs in 4H-SiC”, Materials Science Forum, vols. 264-268, pp. 1005-1008, 1998.

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