Silicided base structure for high frequency transistors

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Bipolar transistor

Reexamination Certificate

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C257S166000, C257S198000, C257S587000, C257SE29188

Reexamination Certificate

active

08084786

ABSTRACT:
High frequency performance of (e.g., silicon) bipolar devices is improved by reducing the extrinsic base resistance Rbx. Emitter, base and collector regions are formed in or on a semiconductor substrate. The emitter contact has a portion that overhangs a portion of the extrinsic base contact, thereby forming a cave-like cavity between the overhanging portion of the emitter contact and the underlying regions of the extrinsic base contact. When the emitter contact and the extrinsic base contact are silicided, some of the metal atoms forming the silicide penetrate into the cavity so that the highly conductive silicided extrinsic base contact extends under the edge of the emitter contact closer to the base itself, thereby reducing Rbx. Smaller Rbx provides transistors with higher fMAX.

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