Silica and silica-based slurry

Compositions – Etching or brightening compositions

Reexamination Certificate

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C252S079200, C252S079300, C252S079400

Reexamination Certificate

active

10627776

ABSTRACT:
This invention relates to a silica, a slurry composition, and a method of their preparation. In particular, the silica of the present invention includes aggregated primary particles. The slurry composition which incorporates the silica, is suitable for polishing articles and especially useful for chemical-mechanical planarization of semiconductor substrates and other microelectronic substrates.

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