Signal transmission structure, package structure and bonding...

Details Signal transmission structure, package structure and bonding... Signal transmission structure, package structure and bonding...

2007-01-05

2010-11-23

Patel, Ishwarbhai B (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000

Reexamination Certificate

active

07838777

ABSTRACT:
A signal transmission structure including a first signal pad, a first reference plane surrounding the first signal pad, a second signal pad, a second reference plane surrounding the second signal pad, an electric conductive element, and a conductive wall is provided. The second reference plane is parallel to the first reference plane, and the electrical conductive element is connected between the first signal pad and the second signal pad to transmit a signal. The conductive wall is connected between the first reference plane and the second reference plane and surrounding the electrical conductive element. Furthermore, a package structure applying to the signal transmission structure and a bonding method thereof are provided.

REFERENCES:
patent: 6812412 (2004-11-01), Obata et al.
patent: 6969808 (2005-11-01), Shiraki
patent: 7404250 (2008-07-01), Cheng et al.
patent: 7408120 (2008-08-01), Kim et al.

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