Wave transmission lines and networks – Coupling networks – With impedance matching
Reexamination Certificate
2006-06-20
2006-06-20
Lee, Benny (Department: 2817)
Wave transmission lines and networks
Coupling networks
With impedance matching
C333S238000
Reexamination Certificate
active
07064627
ABSTRACT:
A signal transmission structure is provided. The structure comprises a reference plane, a bonding pad, a conductive trace and a conductive ball. By changing the shapes of the reference plane and the conductive trace, the equivalent capacitance at the conductive ball and the signal route near the conductive ball is reduced, or the equivalent inductance at the conductive ball and the signal route near the conductive ball is increased to compensate the high equivalent capacitance between the conductive ball and the reference plane. Therefore, the impedance of the conductive ball and the signal route near the conductive ball are matched to increase the integrity of the signals after these signals pass through the conductive ball and the signal neighbor route near the conductive ball.
REFERENCES:
patent: 5021866 (1991-06-01), Sudo et al.
patent: 5184095 (1993-02-01), Hanz et al.
patent: 6624729 (2003-09-01), Wright et al.
patent: 05-029772 (1993-02-01), None
patent: 07-147352 (1995-06-01), None
J.C. Patents
Lee Benny
VIA Technologies Inc.
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