Signal transmission circuit, IC package, and mounting board

Details Signal transmission circuit, IC package, and mounting board Signal transmission circuit, IC package, and mounting board

2008-08-21

2011-12-20

Semenenko, Yuriy (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C333S236000, C333S243000, C333S02200F

Reexamination Certificate

active

08081487

ABSTRACT:
Provided is a signal transmission circuit capable of realizing the same effects as those in a conventional manner that employs a complicated circuit by using no complicated circuit, that is, by a simple circuit. The signal transmission circuit includes: a transmission path having a first impedance; a terminating resistor having a predetermined resistance; a transmission path having a second impedance, which is connected to the transmission path and the terminating resistor, the second impedance being higher than both of the first impedance and the predetermined resistance; and an input buffer for receiving a signal at a connection portion of the transmission path and the transmission path.

REFERENCES:
patent: 6172539 (2001-01-01), Tagishi
patent: 6208161 (2001-03-01), Suda
patent: 6490325 (2002-12-01), Fiedler et al.
patent: 7501910 (2009-03-01), Yamagishi et al.
patent: 2001/0040471 (2001-11-01), Urakawa
patent: 2007/0127404 (2007-06-01), Best
patent: 8-297924 (1996-11-01), None
Yamagishi et al., IEEE 14th, Topical Meeting Electrical Performance of Electronic PAckaging (EPEP), Oct. 2005, pp. 209-212.

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