Signal transmission arrangement and method

Details Signal transmission arrangement and method Signal transmission arrangement and method

2011-07-26

2011-07-26

Landau, Matthew C (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S691000, C257S690000, C257SE25013, C257SE23079

Reexamination Certificate

active

07986044

ABSTRACT:
Data signals are transmitted between a number of semiconductor chips which are connected to one another in a common chip package. For that a signal transmission arrangement is set up for a transmission of the signals via in each case one transmitting/receiving interface which is arranged at the chip ends of a power supply connection which connects the number of semiconductor chips.

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patent: 10 2004 010 852 (2005-11-01), None

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