Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1995-12-04
1997-09-02
Powell, William
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
216 39, 361748, 428209, 428901, B44C 122, C23F 100
Patent
active
056628161
ABSTRACT:
A microwave arrangement, such as a splitter and combiner, is formed by sandwiching a conductive ground plane between two dielectric microstrip boards whose outer faces carry RF traces and extending the ground plane with a conductive plurality of distributed via holes that contact the ground plane and pass through the boards to their outer faces. Connections are made between the traces on the surfaces with additional conductive via holes that pass through the ground plane where the ground plane forms openings for passage of the via holes.
REFERENCES:
patent: 4970106 (1990-11-01), DiStefano et al.
patent: 5567330 (1996-10-01), Dorothy
Lucent Technologies - Inc.
Powell William
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