Signal isolating microwave splitters/combiners

Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole

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Details

216 39, 361748, 428209, 428901, B44C 122, C23F 100

Patent

active

056628161

ABSTRACT:
A microwave arrangement, such as a splitter and combiner, is formed by sandwiching a conductive ground plane between two dielectric microstrip boards whose outer faces carry RF traces and extending the ground plane with a conductive plurality of distributed via holes that contact the ground plane and pass through the boards to their outer faces. Connections are made between the traces on the surfaces with additional conductive via holes that pass through the ground plane where the ground plane forms openings for passage of the via holes.

REFERENCES:
patent: 4970106 (1990-11-01), DiStefano et al.
patent: 5567330 (1996-10-01), Dorothy

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