Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-10-23
1999-11-09
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361767, 361768, 361735, 361785, 361683, 361791, 361700, 361777, 439 70, 439 60, 439 68, 439 75, 257692, 257700, 257713, 257717, H05K 118
Patent
active
059826355
ABSTRACT:
An interconnect structure adapts one or more signals conducted between a printed circuit board (PCB) and an integrated circuit (IC) including leads, the IC having signal requirements not provided by the PCB. The interconnect structure includes sockets that provideA. conductive paths between the circuit board and some, but not all, of the leads on the package. To adapt the signals, the interconnect structure also includes an intermediate adaptor board that includes one or more electrical components. The adaptor board and the sockets fit beneath the package containing the IC and above the PCB, and do not extend beyond the lateral boundaries of the package. Heat generated by these components during operation of the IC is dissipated through the IC package via a layer of thermally conductive material sandwiched between the component and the package. The intermediate adaptor board and the socket combine to perform all necessary signal conversion, including power supply voltage levels, between the circuit board and the IC.
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Mackey Dale S.
Menzies L. William
Menzies Stephen W.
Concept Manufacturing, Incorporated
Foster David
MacDonald Thomas S.
Picard Leo P.
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