Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent
1992-05-14
1994-04-26
Mintel, William
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
257757, 257761, 257764, 257768, H01L 2348, H01L 2352, H01L 2940
Patent
active
053069510
ABSTRACT:
A process and structure for improving the conductive capacity of a polycrystalline silicon (poly) structure, such as a bit line. The inventive process allows for the formation of a refractory metal silicide layer on the top and sidewalls of a poly structure, thereby increasing the conductive capacity. To form the titanium silicide layer over the poly feature, the refractory metal is sputtered on the poly, which reacts to form the refractory metal silicide. A second embodiment is described whereby an isotropic etch of the poly feature slopes the sidewalls; then, the refractory metal is sputtered onto the polycrystalline silicon. This allows for the formation of a thicker layer of refractory metal silicide on the sidewalls, thereby further increasing the conductive capacitance of the poly structure. Suggested refractory metals include titanium, cobalt, tungsten, and tantalum.
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Gonzalez Fernando
Lee Roger R.
Lowrey Tyler A.
Loke Steven
Micro)n Technology, Inc.
Mintel William
Protigal Stanley N.
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