Sidewall anti-fuse structure and method for making

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

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257390, 365 96, H01L 2702, H01L 1700

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active

053651057

ABSTRACT:
A described embodiment of the present invention includes an anti-fuse comprising: a first conductive layer having a horizontal major surface and having a substantially vertical sidewall; a thick insulating layer formed on the horizontal major surface of the first conductive layer; a dielectric layer formed on the vertical sidewall; and a second conductive layer formed on the dielectric layer. In an additional embodiment, the first and/or second conductive layers comprise polycrystalline silicon and a conductive material selected from the group of titanium, tungsten, molybdenum, platinum, titanium silicide, tungsten silicide, molybdenum silicide, platinum silicide, titanium nitride and combinations thereof.

REFERENCES:
patent: 4899205 (1990-02-01), Hamdy et al.
patent: 4914055 (1990-04-01), Gordon et al.

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