Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2002-12-05
2004-03-23
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S697000, C257S718000, C257S722000, C174S016100, C174S016300, C165S080300, C165S122000, C165S185000
Reexamination Certificate
active
06711016
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a side-exhaust heat dissipation module, and in particular to a side-exhaust heat dissipation module for effectively cooling a CPU on a main board.
2. Description of the Related Art
Referring to
FIG. 1
, the conventional heat dissipation module
1
is composed of a fan
2
and a heat sink
4
with plural fins
6
formed thereon. According to the heat flow simulation analysis as shown in
FIG. 2
, the conventional heat dissipation module
1
has the following drawbacks.
(1) The airflow from the fan
2
flows through the heat sink
4
and flows out via opposite sides of the fins
6
. Obviously, there is no airflow passing through the central area A of the heat sink
4
. Thus, the efficiency of thermal exchange in the central area A is very low. The heat generated by the CPU
8
is concentrated on the central area A of the heat sink
4
and the spindle
22
of the fan
2
is located above the central area A. Thus, there is no airflow flowing through the fins
6
in the central area A and the efficiency of heat dissipation of the conventional heat dissipation module
1
is enormously reduced.
(2) The heat sink
4
has a flat bottom and the airflow form the fan
2
flows downwardly to the flat bottom. Because of the short distance between the fan
2
and the heat sink
4
and the high density of the fins
6
, the airflow is subject to a high back pressure. Thus, the amount of the airflow from the fan
2
is decreased and the efficiency of heat dissipation of the conventional heat dissipation module
1
is reduced.
Referring to
FIG. 3
, a conventional side-exhaust heat dissipation module
50
is provided to overcome the above problems. The fan
52
of the conventional side-exhaust heat dissipation module
50
is disposed on one side of the heat sink
54
. The airflow from the fan
52
can flow through the heat sink
54
completely. The heat generated on the central area of the heat sink
54
can be guided to the fins
56
and dissipated to the atmosphere via thermal convection.
Referring to
FIG. 4
, in the conventional side-exhaust heat dissipation module
50
, the lateral sides of the fins
56
adjacent to the fan
52
are vertical and the fins
56
are closely adjacent to the fan
52
. A large central circulation zone B or a stagnation zone is formed in the front portion (the portion facing the fan
52
) of the fins
56
. In addition, because the airflow speeds in the upper and lower portions of the fins
56
are faster and the airflow speed in the central portion of the fins
56
is slower, the airflow distribution is not uniform across the fins
56
. Thus, the efficiency of heat dissipation of the conventional side-exhaust heat dissipation module
50
is not enormously enhanced as compared to that of the conventional heat dissipation module
1
.
Referring to
FIG. 5
, in order to solve the central circulation zone B or the non-airflow zone as mentioned above, an airflow guiding cover
58
is disposed on the fins
56
and the fan
52
is spaced from the fins
56
by a distance d such that a regulation zone exists between the fan
52
and the fins
56
. Thus, the central circulation zone B of
FIG. 4
is reduced to a central circulation zone B′ and the airflow distribution across the fins
56
is more uniform.
Referring to
FIG. 6
, in order to further reduce or eliminate the central circulation zone, the fan
52
can be spaced from the fins
56
by a larger and preferred distance D.
Although the efficiency of heat dissipation of the conventional side-exhaust heat dissipation module
50
is enormously enhanced since the fan
52
is spaced from the fins
56
by a preferred distance D, the total volume of the conventional side-exhaust heat dissipation module
50
increases enormously as well, thus decreasing the useful inner space in the computer.
SUMMARY OF THE INVENTION
An object of the invention is to provide a side-exhaust heat dissipation module. The side-exhaust heat dissipation module comprises a base; a fan disposed on one side of the base; a fin assembly disposed on the base and composed of a plurality of parallel fins, the fin assembly having a concave end spaced from the fan by a predetermined distance; and an airflow guiding cover disposed on the fin assembly, wherein the airflow guiding cover is gradually expanded and extended from the fan to cover the fin assembly.
A detailed description will be given by the following embodiments with reference to the accompanying drawings.
REFERENCES:
patent: 5526875 (1996-06-01), Lin
patent: 6459580 (2002-10-01), Della Fiora et al.
patent: 6460609 (2002-10-01), Cho et al.
patent: 6478082 (2002-11-01), Li
patent: 6498395 (2002-12-01), Baek et al.
patent: 6501651 (2002-12-01), Lin et al.
patent: 6533028 (2003-03-01), Sato
Chung Chao-Tsai
Lin Po-Yao
ASUSTek Computer Inc.
Birch & Stewart Kolasch & Birch, LLP
Chervinsky Boris
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