Side-emitting LED package and method of manufacturing the same

Details Side-emitting LED package and method of manufacturing the same Side-emitting LED package and method of manufacturing the same

2008-06-12

2010-11-16

Parker, Kenneth A (Department: 2815)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S022000, C438S025000, C438S026000, C438S029000, C257S079000, C257S103000

Reexamination Certificate

active

07833811

ABSTRACT:
The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.

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Japanese Office Action issued in Japanese Patent Application No. JP 2006-152714, dated Sep. 29, 2009.

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