Side-emitting LED package and manufacturing method of the same

Details Side-emitting LED package and manufacturing method of the same Side-emitting LED package and manufacturing method of the same

2006-06-01

2008-03-04

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

C438S026000, C438S113000, C438S116000, C257SE33072, C257SE33059

Reexamination Certificate

active

07338823

ABSTRACT:
The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.

REFERENCES:
patent: 6345903 (2002-02-01), Koike et al.
patent: 6638780 (2003-10-01), Fukasawa et al.
patent: 6674096 (2004-01-01), Sommers
patent: 6945672 (2005-09-01), Du et al.
patent: 2005/0151142 (2005-07-01), Imai
patent: 09-083019 (1997-03-01), None
patent: 10-125959 (1998-05-01), None

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