Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Reexamination Certificate
2011-08-09
2011-08-09
Lee, Cheung (Department: 2812)
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
C438S689000, C438S706000, C438S906000, C257SE21224, C257SE21226, C257SE21245
Reexamination Certificate
active
07994066
ABSTRACT:
A method is disclosed for the cleaning of a Si surface at low temperatures. Oxide on the Si surface is brought into contact with Ge, which then sublimates off the surface. The Ge contamination remaining after the oxide removal is cleared away by an exposure to an alkali halide. The disclosed cleaning method may by used in semiconductor circuit fabrication for preparing surfaces ahead of epitaxial growth.
REFERENCES:
patent: 5089441 (1992-02-01), Moslehi
patent: 5403434 (1995-04-01), Moslehi
patent: 6858503 (2005-02-01), Ngo et al.
patent: 6887773 (2005-05-01), Gunn
patent: 7129184 (2006-10-01), Chang
patent: 7235492 (2007-06-01), Samoilov
patent: 7416989 (2008-08-01), Liu et al.
patent: 2006/0138566 (2006-06-01), Chakravarti et al.
patent: 2006/0169668 (2006-08-01), Samoilov
patent: 2007/0012932 (2007-01-01), Kobayakawa et al.
patent: 2009/0075447 (2009-03-01), Meunier-Beillard et al.
“Effect of Si-Ge buffer layer for low-temperature Si epitaxial growth on Si substrate by RF plasma chemical vapor deposition”, S. Suzuki et al., J. Appl. Phys. 54, 1466 (1983).
“Oxygen removal from Si via reaction with adsorbed Ge”, J. F. Morar et al., Appl. Phys. Lett. 50, 463 (1987).
“Reduction reaction of native oxide at the initial stage of GeH4chemical vapor deposition on (100)Si”, Y. Takahasi et al., Appl. Phys. Lett. 57, 599 (1990).
“Alternate surface cleaning approaches for ultra high-vacuum chemical vapor-deposition epitaxy of Si and GexSi1-x”, M. Racanelli et al., J. Electrochem. Soc. 138, 3783 (1991).
“The viability of GeH4-based in situ clean for low temperature silicon epitaxial growth”, C. L. Wang et al. , J. Electrochem. Soc. 143, 2387 (1996).
“Chemical vapour etching of Si, SiGe and Ge with HCI; applications to the formation of thin relaxed SiGe buffers and to the revelation of threading dislocations”, Y. Bogumilowicz et al., Semicond. Sci. Technol. 20, 127 (2005).
“Interaction of Ge atoms with silica surfaces”, S.K. Stanley et al., Appl. Surf. Sci. 252, 878 (2005).
Capellini Giovanni
Gunn III Lawrence C.
Masini Gianlorenzo
White Joseph W.
Witzens Jeremy
Lee Cheung
Luxtera Inc.
Sai-Halasz George
LandOfFree
Si surface cleaning for semiconductor circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Si surface cleaning for semiconductor circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Si surface cleaning for semiconductor circuits will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2620224