SI.sub.3 N.sub.4 process using polysilane as a binder

Details SI.sub.3 N.sub.4 process using polysilane as a binder SI.sub.3 N.sub.4 process using polysilane as a binder

1992-01-15

1992-12-01

Derrington, James

Plastic and nonmetallic article shaping or treating: processes

Including step of generating heat by friction

264 86, 264 87, 264344, 501 97, C04B 3332

Patent

active

051678870

ABSTRACT:
A method of making fully dense, crack-free silicon nitride articles using polysilanes as a binder. Polysilane is dissolved in a solvent and a silicon nitride composition including a densification aid is added to form a homogeneous mixture. The mixture is dried to form a powder, and molded at a temperature less than 100.degree. C. to form a molded article. Alternatively, the slurry is poured into a mold and vacuum filtered to form a cake, then isostatically pressed at a temperature of approximately 90.degree. C. The molded article or pressed cake is heated at a rate of approximately 5.degree. C./min to about 900.degree. C. in a nonoxidizing atmosphere and held at about 900.degree. C. for a time sufficient to decompose the polysilane. The article is sintered in a nonoxidizing atmosphere at a temperature of about 1685.degree.-1900.degree. C. to form a silicon nitride article free of cracks and having a density greater than 3.5 g/cc.

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K. B. Schwartz, D. J. Rowcliffe, and Y. D. Blum, Microstructural Development in Si.sub.3 N.sub.4 /Polysilazane Bodies During Heating.

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