Shroud retention wafer

Electrical connectors – With supporting means for coupling part – Comprising or for use with supporting panel

Reexamination Certificate

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Reexamination Certificate

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06851974

ABSTRACT:
An insulative shroud retention wafer for an electrical connector allowing for an optimization of pin placements of the electrical connector is provided. In an illustrative embodiment the shroud retention wafer comprises a first (66), second (68), third (70), and fourth (72) cylindrical members, each having an axial pin receiving aperture (86) and an axial center line (78, 80) extending through the pin receiving aperture (86). Furthermore, the cylindrical members maintain at least one protuberance (100). In operation, the cylindrical members of the shroud retention wafer couple with pins of the electrical connector to realize an electrical connection. Specifically, the protuberance (100) causes collapse of the cylinders (66,68,70,72) allowing for better gripping of pins of the electrical connector. The arrangement of the cylinders (66,68,70,72) of the shroud retention (28) wafer maximizes the number of cylindrical members on the wafer allowing for optimization of pin placement.

REFERENCES:
patent: 2976345 (1961-03-01), Whitted
patent: 3815077 (1974-06-01), Anhalt et al.
patent: 4451507 (1984-05-01), Beltz et al.
patent: 4548450 (1985-10-01), Reimer et al.
patent: 4601527 (1986-07-01), Lemke
patent: 4655518 (1987-04-01), Johnson et al.
patent: 4749373 (1988-06-01), Brekosky et al.
patent: 4775333 (1988-10-01), Grider et al.
patent: 4808118 (1989-02-01), Wilson et al.
patent: 4836791 (1989-06-01), Grabbe et al.
patent: 4869677 (1989-09-01), Johnson et al.
patent: 5015192 (1991-05-01), Welsh et al.
patent: 5110307 (1992-05-01), Rapoza
patent: 5151036 (1992-09-01), Fusselman et al.
patent: 5169324 (1992-12-01), Lemke et al.
patent: 5215473 (1993-06-01), Brunker et al.
patent: 5263882 (1993-11-01), Peterson
patent: 5344341 (1994-09-01), Yoshimo
patent: 5522730 (1996-06-01), Soes et al.
patent: 5542860 (1996-08-01), Bandura et al.
patent: 6322393 (2001-11-01), Doutrich et al.
patent: 39 366 466 (1991-05-01), None

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