Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-10-11
1998-01-13
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
3613212, 3613214, 361313, 361320, 361763, 361766, 428210, 428212, H01G 412, H05K 116, B32B 1800
Patent
active
057085706
ABSTRACT:
A glass-ceramic substrate for encapsulating an electronic component, with at least two shrinkage control layers restricting shrinkage of the substrate during a co-firing process. The shrinkage control layers are chosen so that they have substantially the same shrinkage characteristics, during co-firing, as the buried electronic component. This results in substantially no differential shrinkage between the electronic component and the substrate, along predetermined directions, during co-firing. In addition, the thermal expansion coefficients of the substrate, shrinkage control layers and electronic component are chosen so that they substantially match, such that their thermal-induced contraction during the cooling phase of the co-firing process substantially match. In the preferred embodiment, the electronic component is buried within the layers of an LTCC structure. The shrinkage control layers are preferably implemented as Al.sub.2 O.sub.3 or TiO.sub.2 filled dielectric green tape layers on top and bottom LTCC layers. A buried capacitor LTCC package is specifically disclosed.
REFERENCES:
patent: 4861646 (1989-08-01), Barringer et al.
patent: 5055966 (1991-10-01), Smith et al.
patent: 5144526 (1992-09-01), Vu et al.
patent: 5242867 (1993-09-01), Lin et al.
patent: 5387474 (1995-02-01), Mikeska et la.
patent: 5604673 (1997-02-01), Washburn et al.
Ramona G. Pond et al., "Processing and Reliabiity of Resistors Incorporated Within Low Temperature Cofired Ceramic Structures", 1996 ISHM proceedings, pp. 461-472.
H. T. Sawhill et al., "Low Temperature Co-Fireable Ceramics with Co-Fired Resistors", 1986 ISHM Proceedings, pp. 473-480.
H. Nishikawa et al., "Development of Zero X-Y Shrinkage Sinterd Ceramic Substrate", Proceedings of the Japan International Electronic Manufacturing Technology Symposium, (1993) pp. 238-241.
William A. Vitriol et al., "Development of a Low Temperature Cofired Multilayer Ceramic Technology", 1983 ISHM Proceedings, pp. 593-598.
Denson-Low W. K.
Hughes Aircraft Company
Lachman M. E.
Picard Leo P.
Sales M. W.
LandOfFree
Shrinkage-matched circuit package utilizing low temperature co-f does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Shrinkage-matched circuit package utilizing low temperature co-f, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Shrinkage-matched circuit package utilizing low temperature co-f will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-331197