Short pulse soldering system

Details Short pulse soldering system Short pulse soldering system

1984-01-25

1984-11-20

Shaw, C. C.

Electric heating

Metal heating

For bonding with pressure

219 85F, B23K 112

Patent

active

044840543

ABSTRACT:
A system for rapidly soldering wire to terminal pads of a printed circuit board. A soldering tool is heated to a high temperature above 1000 degrees F., and preferably between 1600 to 2000 degrees F., and has a predetermined effective mass for holding a quantum of heat just sufficient to make an effective solder joint over a broad range of terminal pad conditions.

REFERENCES:
patent: 3444347 (1969-05-01), Mulcahy
patent: 3650450 (1972-03-01), Larson et al.
patent: 3673681 (1972-07-01), Steranko
patent: 3751624 (1973-08-01), Banks et al.
patent: 3778581 (1973-12-01), Denny
patent: 3812581 (1974-05-01), Larson et al.
patent: 3891822 (1975-06-01), Laub et al.
patent: 4031612 (1977-06-01), Nicolas
D.A. Lapedes, Ed., McGraw-Hill Dictionary of Scientific & Technical Terms, 1974, p. 189.
CIT Alcatel brochure, "The New Wiring Method".
Augat brochure, "Unilayer Discrete Wiring System".
Circon Corp. brochure, "Micro Soldering Systems".

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