Active solid-state devices (e.g. – transistors – solid-state diode – Bulk effect device – Bulk effect switching in amorphous material
Reexamination Certificate
2008-05-23
2010-11-02
Jackson, Jr., Jerome (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Bulk effect device
Bulk effect switching in amorphous material
C257S004000, C257SE45002
Reexamination Certificate
active
07825397
ABSTRACT:
Random access memory cells having a short phase change bridge structure and methods of making the bridge structure via shadow deposition. The short bridge structure reduces the heating efficiency needed to switch the logic state of the memory cell. In one particular embodiment, the memory cell has a first electrode and a second electrode with a gap therebetween. The first electrode has an end at least partially non-orthogonal to the substrate and the second electrode has an end at least partially non-orthogonal to the substrate. A phase change material bridge extends over at least a portion of the first electrode, over at least a portion of the second electrode, and within the gap. An insulative material encompasses at least a portion of the phase change material bridge.
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Xi Haiwen
Xue Song S.
Budd Paul A
Campbell Nelson Whipps LLC
Jackson, Jr. Jerome
Seagate Technology LLC
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