Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-08-16
2005-08-16
Lee, Eddie (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S718000, C361S704000, C438S117000, C438S122000
Reexamination Certificate
active
06930386
ABSTRACT:
A semiconductor mounting arrangement inclusive of a heat sink member enabling desirable resistance to physical impact damage to the semiconductor device, the heat sink and the printed circuit board supporting the semiconductor device and the heat sink. The heat sink is fabricated of thermally and electrically conductive metal such as copper and captured by metallic interconnection such as soldering to conductors of the printed circuit board. Efficient thermal and electrical conductivity between semiconductor device and heat sink are achieved also by metallic interconnection such as soldering intermediate the semiconductor device and the heat sink. Desirable semiconductor device performance under extreme electrical and physical force transient loading conditions are disclosed.
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patent: 5648889 (1997-07-01), Bosli
patent: 6353537 (2002-03-01), Egawa
patent: 6380906 (2002-04-01), Cesulka
patent: 6453790 (2002-09-01), Cesulka et al.
patent: 6456240 (2002-09-01), Cesulka
patent: 6535383 (2003-03-01), Terhaar et al.
patent: 6625021 (2003-09-01), Lofland et al.
AFMCLO/JAZ
Hollins Gerald B.
Lee Eddie
Owens Douglas W.
The United States of America as represented by the Secretary of
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