Shipping device with bondable foam layer

Details Shipping device with bondable foam layer Shipping device with bondable foam layer

1997-02-05

1998-11-17

Sewell, Paul T.

Special receptacle or package

For a plant, flower, or tree

206523, 206813, 53472, B65D 8550, B65D 8552

Patent

active

058364480

ABSTRACT:
A method and apparatus for preparing an item or plurality of items for shipment. Disposing one or a plurality of items on a rigid surface having a deformable foam layer with a bonding material thereon wherin the items are connectingly bonded to the foam layer which is deformed in response to the items. The items may be items of china, floral containers, and flower pots, or other similar items.

REFERENCES:
patent: 1064813 (1913-06-01), Bloomberg
patent: 2165539 (1939-07-01), Dahlgren
patent: 2373634 (1945-04-01), Wagner
patent: 2578583 (1951-12-01), O'Brien
patent: 2664670 (1954-01-01), Mulford
patent: 2707352 (1955-05-01), Fischer
patent: 2721022 (1955-10-01), Billerbeck
patent: 2744624 (1956-05-01), Hoogstoel et al.
patent: 2871080 (1959-01-01), Shelly
patent: 2887220 (1959-05-01), Hankus
patent: 3113673 (1963-12-01), Stein
patent: 3322323 (1967-05-01), Green et al.
patent: 3374884 (1968-03-01), Chinkes
patent: 3389784 (1968-06-01), Hendricks et al.
patent: 3466214 (1969-09-01), Polk et al.
patent: 3708946 (1973-01-01), Cahill
patent: 3725188 (1973-04-01), Kalt
patent: 3734280 (1973-05-01), Amneus et al.
patent: 3754642 (1973-08-01), Stidolph
patent: 3883990 (1975-05-01), Stidolph
patent: 3924354 (1975-12-01), Gregoire
patent: 4053049 (1977-10-01), Beauvais
patent: 4170301 (1979-10-01), Jones et al.
patent: 4396120 (1983-08-01), Morita
patent: 4470508 (1984-09-01), Yen
patent: 5065922 (1991-11-01), Harris
patent: 5092465 (1992-03-01), Weder et al.
patent: 5111638 (1992-05-01), Weder
patent: 5148918 (1992-09-01), Weder et al.
patent: 5196637 (1993-03-01), Weder
patent: 5226557 (1993-07-01), Nelson
patent: 5240109 (1993-08-01), Weder et al.
patent: 5255784 (1993-10-01), Weder et al.
patent: 5311992 (1994-05-01), Weder et al.
patent: 5322181 (1994-06-01), Nelson
patent: 5407072 (1995-04-01), Weder et al.
patent: 5411137 (1995-05-01), Weder et al.
patent: 5522205 (1996-06-01), Weder
patent: 5584392 (1996-12-01), Weder et al.
Oasis Grower Products; Smithers-Oasis; Kent, OH; 1991.

Affiliated with

Also associated with

Rating

Shipping device with bondable foam layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Shipping device with bondable foam layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Shipping device with bondable foam layer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-876368