Shipping container for semiconductor substrate wafers

Special receptacle or package – For a vehicle

Patent

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Details

206454, 206587, 206586, 220324, B65D 8548

Patent

active

042483468

ABSTRACT:
A shipping container for semiconductor substrate wafers including a rectangular receptacle having a plurality of outwardly extending aligned and opposing vertical rib members which are spaced on the interior opposing sides of the receptacle, and interchangeable upper and lower cover members having finger and post structure to support and space each of the wafers. The upper and lower cover members engage with the outer sides of the receptacle. The receptacle includes latching crossbars across offset ends of each side of the receptacle which engage with locking members extending from each end of the upper and lower cover members. The upper and lower cover members include a plurality of opposing fingers spaced the longitudinal distance of the covers which support the wafer at arcuate points on the wafer and a plurality of posts spaced in between the opposing fingers along the longitudinal distance of the covers which provide separation between each of the wafers. In another embodiment, a pair of longitudinal extending opposing ribs run the longitudinal length of the receptacle which provide support for the wafers when the lower cover is removed. In a further embodiment, the upper and lower covers are provided with upward and outwardly extending ribs in lieu of the fingers and posts which provide support and separation of the wafers and align with the ribs of the receptacle.

REFERENCES:
patent: 2735542 (1956-02-01), Shnitzler
patent: 3214055 (1965-10-01), Schmidt
patent: 3410391 (1968-11-01), Kanter
patent: 3465467 (1969-09-01), Allen
patent: 4043451 (1977-08-01), Johson
patent: 4091919 (1978-05-01), MacLeod et al.
patent: 4171740 (1979-10-01), Clement et al.
IBM Technical Bulletin, vol. 16, No. 7, 12/1973, Brenneman et al.

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