Shieled enclosure for electronics

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Patent

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Details

361796, 361810, 361818, 174 35R, H05K 900

Patent

active

055660550

ABSTRACT:
An EMI/RFI shielded cover plate assembly for an electronics enclosure includes a cover plate having a major surface area with outwardly-projecting walls or flanges defining interface locations with the underlying enclosure. A shielding compound is provided across the entire cover plate including the walls or flanges. The shielding compound is disposed in a relatively thin layer across the major surface area of the cover plate for EMI/RFI shielding, and in a thicker layer at the interface locations to provide a gasket-like response for environmentally sealing the cover plate assembly to the underlying enclosure and for thermal transfer and electrical continuity. The shielding compound can be compression molded with the cover plate. The shielded cover plate assembly provides a simple and economical method for providing a EMI/RFI shield and a gasket from a single shielding compound.

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