Shielding of semiconductor module

Stock material or miscellaneous articles – Sheet including cover or casing – Noninterengaged fibered material encased

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428136, 428137, 428155, 428209, 428901, 428198, 174 36, B32B 300

Patent

active

048573752

ABSTRACT:
A copper foil sheet is pasted onto the surface of a semiconductor module case to shield it from static electricity and noise. The sheet is provided with cross-cut lines corresponding to the positions of protruding parts on the surface of the case such that the sheet can be pasted along the contours of these protruding parts to improve its shielding effects.

REFERENCES:
patent: 2963535 (1960-12-01), Wegener et al.
patent: 3613230 (1971-10-01), Griff
patent: 3624267 (1971-11-01), Plummer
patent: 3968287 (1976-07-01), Balk

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