Shielding method and apparatus for use in electroplating process

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Controlling current distribution within bath

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

2042302, 2042303, 204297R, 204DIG7, 205125, 205136, C25D 500, C25D 1700

Patent

active

06132583&

ABSTRACT:
An electroplating system includes a tank that holds an electrolytic bath solution. An anode within the tank receives a first voltage having a first potential. A substrate cathode, immersible in the solution within the tank, spaced from the anode, receives a second voltage having a second potential, opposite to that of the first potential. A shield is immersible in the solution within the tank between the anode and cathode. The level of shielding provided by the shield is variable and controllable. In one embodiment, the shield includes a conductive element that receives a third voltage having the first potential, the magnitude of the third voltage being controllable. In another embodiment, the shield includes at least one louver, the physical orientation of which is controllably adjustable. The shield is sufficiently spaced from the substrate cathode to be substantially outside an area of sparging and is fixed between the anode and cathode. In an embodiment of the electroplating system, the substrate cathode is movable in horizontal directions toward and away from the anode while the shield is stationary in such horizontal directions.

REFERENCES:
patent: 3880725 (1975-04-01), Van Raalte et al.
patent: 4534832 (1985-08-01), Doiron, Jr.
patent: 4879007 (1989-11-01), Wong
patent: 5401370 (1995-03-01), Kauper et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Shielding method and apparatus for use in electroplating process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Shielding method and apparatus for use in electroplating process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Shielding method and apparatus for use in electroplating process will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-464878

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.