Shielding device used for various components mounted on...

Details Shielding device used for various components mounted on... Shielding device used for various components mounted on...

2005-03-29

2005-03-29

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257S660000, C361S800000, C361S816000, C361S818000

Reexamination Certificate

active

06873031

ABSTRACT:
A shielding device is provided in which a layer of deformable electrically conductive material is conformed to fit over the components on the board. In one embodiment of the invention the deformable material is conductive foam, such as metalized foam. One or both sides of the foam layer can be covered with dielectric material. Portions of the dielectric material and foam can be removed, such as from the bottom layer to create insulating slants over the components. Cuts in the deformable material lead to compression only over the component. The board can be placed over the components, which are received in recesses in the shield which are either preformed or result from compression of the deformable material at the location of the components. In one embodiment of the invention, regions of conductive layer are removed and the layer is placed over the components. A top layer is placed thereover. The invention also relates to the method of foaming the board level shield.

REFERENCES:
patent: 5576710 (1996-11-01), Broderick et al.
patent: 5758401 (1998-06-01), Nelson
patent: 6248393 (2001-06-01), Bunyan et al.

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