Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1998-11-25
2001-01-23
Gandhi, Jayprakash N. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S736000, C361S759000, C361S741000, C361S800000, C439S076100, C206S719000
Reexamination Certificate
active
06178096
ABSTRACT:
FIELD OF THE INVENTION
This invention relates to a high speed transceiver module and, more particularly, to a shielding cover for such a module.
BACKGROUND OF THE INVENTION
Fibre Channel and Gigabit Ethernet are high speed data transfer interfaces that can be used to interconnect workstations, mainframes, supercomputers and storage devices. Supporting numerous channel and network Upper Level Protocols (ULPs), Fibre Channel allows faster data transfer over longer distances between a larger number of devices or communication points. The standard combines attributes of a channel with attributes of a network, thus providing a general transport vehicle for ULPs such as the Small Computer System Interface (SCSI), the Intelligent Peripheral Interface (IPI), the High Performance Parallel Interface (HIPPI), the Internet Protocol (IP), Ethernet (IEEE 802.3) and the Asynchronous Transfer Mode (ATM). Accommodating the pattern of ever increasing data rates, Fibre Channel is a scalable interconnect standard that considers all aspects of speed, length and media (copper and fiber). Fibre Channel development is focused on data transfer at 1.0625 Gbits/sec with provisions for 2.125 Gbits/sec and 4 Gbits/sec.
AMP Incorporated of Harrisburg, Pa., Compaq Computer Corporation of Houston, Tex., Vixel Corporation of Bothell, Washington and Sun Microsystems Computer Company of Mountain View, Calif. have together agreed on and written a standard for a serial transceiver module, which is called the Gigabit Interface Converter (GBIC) module. The module provides a single small form factor for a wide variety of standard Fibre Channel connectors and transmission media. The module can be inserted in or removed from a host or switch chassis without first removing power from the receiving socket. Any copper and optical transmission technologies consistent with the form factor can be used.
The GBIC module has a plug in a first insulative housing and a receptacle in a second insulative housing at respective opposite ends of the module. A printed circuit board is secured to, and connects, the plug and the receptacle. The module is insertable into a guide structure mounted to a host board and having a receiving end and a terminating end. The terminating end of the guide structure has a receptacle for mating engagement with the module plug when the module is fully inserted in the guide structure. The guide structure houses and aligns the module and provides polarized guide rails to prevent incorrect installation of the module and is designed to accept the side retention latches specified in the GBIC module standard.
Since the GBIC module is designed for high speed data transfer, it would be desirable to provide electromagnetic shielding for the module. Such shielding should effectively cover the module from the plug to the receptacle while still remaining within the form factor of the GBIC module standard.
SUMMARY OF INVENTION
A shielding cover according to the present invention comprises first and second cover parts formed of electrically conductive material. Each of the first and second cover parts has a generally planar major wall parallel to and spaced from the printed circuit board of the module and at least partially covers and extends between the insulative housings of the module plug and receptacle on a respective side of the printed circuit board. Each of the first and second cover parts further includes a pair of opposed side walls orthogonal to the respective major wall and adjacent opposite edges of the printed circuit board. The side walls of the cover parts have features complementary to features of a respective one of the side walls of the other cover part, so that the first and second cover parts can be placed over opposite major surfaces of the printed circuit board and brought together to surround the printed circuit board. Each of the side walls is also formed with a respective ledge which is parallel to and open toward the respective major wall. A pair of latch members are also provided. Each of the latch members cooperates with a respective pair of side walls adjacent a respective edge of the printed circuit board. Each of the latch members has a bifurcated portion adapted to engage a respective opposed ledge on each side wall of the respective pair of side walls to prevent the separation of the first and second cover parts.
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Flickinger Steven L.
Herb William L.
Mayer Lori A.
Schaedler Thomas G.
Sheesley Wilmer L.
Gandhi Jayprakash N.
The Whitaker Corporation
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